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MA4SPS302
SURMOUNTTM PIN Diode RoHS Compliant
Features
Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Average and Peak Power Handling RoHS Compliant Rev. V3
MA4SPS302
Description
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical conic topology provides for exceptional heat transfer from the active area. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.
1. Backside metal: 0.1 M thick. 2. Yellow hatched areas indicate backside ohmic gold
INCHES DIM Min. Max. Min.
MM Max.
A B C
0.052 0.020 0.004 0.018 0.014
0.056 0.024 0.006 0.020 0.016
1.321 0.508 0.102 0.457 0.356
1.422 0.610 0.152 0.508 0.406
Absolute Maximum Ratings TAMB = 25C (unless otherwise specified)
Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power ( RF & DC ) Mounting Temperature Absolute Maximum 600mA | -100V | -55C to +125C -55 C to +150C +175C 800mW +260C for 30 seconds
D E
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNTTM PIN Diode RoHS Compliant
Electrical Specifications @ TAMB = +25C
Symbol CT CT
1
Rev. V3
Conditions -40V, 1MHz -40V, 1GHz 10mA, 100MHz 10mA -10A -70 V
Units pF pF W V V nA C/W ns
Min
Typ 0.40 0.36 1.3 0.84
Max 0.45
1,3
RS2,3 VF VR IR RqJL TL
4
2.2 1.00
-70
-100 100 125 460 1000
IH=1A, IL=10mA +10mA / -6mA
1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Parasitic Capacitance. CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance) 2. 3 Series resistance RS is equivalent to the total diode resistance: RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistance) RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with conductive silver epoxy.
Rs vs. Forward Current and Frequency
3
0.600
CT vs. Reverse Voltage and Frequency
0.500
0V
500uA 2 1mA 2mA
-40V
0.400
-5V
0.300
1
10mA 50mA
0.200
0.100
0 0 100 200 300 400 500 600 700 800 900 1000
0.000 0 100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
Frequency (MHz)
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNTTM PIN Diode RoHS Compliant
MA4SPS302 ADS SPICE Model & Schematic
Rev. V3
MA4SPS302 SPICE Model
MA4SPS302 Schematic
PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=6.5 um Rr=20 K Ohm Cmin=0.40 pF Tau=0.20 usec Rs=0.1 Ohm Cj0=0.50 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=1.0E+6 A/m^2 Kf=0.0 Af=1.0
wBv=100 V wPmax=0.8 W Ffe=1.0
Cp Rp
Ls
Rvia
Rvia
_
Notes :
Rs = 2 * Rvia + Rp
+
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MA4SPS302
SURMOUNTTM PIN Diode RoHS Compliant
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Rev. V3
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn, 60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but could result in an increase in series and thermal resistance. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce thermal and/or mechanical stresses to the die . It is also not recommended to reflow solder by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die after attach is completed. Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in Application Note M538 , "Surface Mounting Instructions". Application Note M541 "Bonding and Handling Procedures for Chip Diode Devices" provides handling and assembly recommendations.
Ordering Information
The MA4SPS302 SURMOUNT are packaged in gel packs.
Part Number Gel Pack MA4SPS302
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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